(Purdue University) Researchers at Purdue University and the University of Virginia have developed a new fabrication method that makes tiny, thin-film electronic circuits peelable from a surface. The technique not only eliminates several manufacturing steps and the associated costs, but also allows any object to sense its environment or be controlled through the application of a high-tech sticker.
from EurekAlert! - Technology, Engineering and Computer Science https://ift.tt/2zKKmnb
Tuesday, July 17, 2018
Electronic stickers to streamline large-scale 'internet of things'
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