(Massachusetts Institute of Technology) A team of researchers at MIT has just accomplished the first detailed high-speed imaging and analysis of the microparticle impact process, and used that data to predict when the particles will bounce away, stick, or knock material off the surface and weaken it. The new findings are described in a paper appearing in the journal Nature Communications.
from EurekAlert! - Technology, Engineering and Computer Science https://ift.tt/2AATwA9
Friday, November 30, 2018
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What happens when materials take tiny hits
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